Chemical mechanical planarization (CMP) removes material from the surface of a wafer to achieve a high-quality foundation for the next layer of a circuit or as a final polishing step. Our next-generation CMP silica sol abrasives are designed to enable targeted selectivity, low defectivity and scratch rate, fast removal rate and high stability in slurry formulation.
We offer a range of colloidal silica abrasives for CMP to cover different slurry needs for different chip types and layers. The abrasive particles have a size distribution, hardness, morphology and surface profile which directly affect critical metrics, including removal rate and wafer defects.
